Parameter
Technical parameters	Main body of laser	1000mm940mm 1520 mm
	Weight of machine	450Kg
	Power	AC220 V
	Laser	355 nm
	Laser	Optowave 10W(US)
	Material	≤1.2 mm
	Precisio	±20 μm
	Platfor	±2 μm
	Platform	±2 μm
	Working area	300*300mm
	Maximum	3 KW
	Vibrating	CTI(US)
	Power	AC220 V
	Diameter	20±5 μm
	Ambient	20±2 ℃
	Ambient	＜60 %
	The Machine	Marble

PCB Depaneling Machine Advantages

The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

PCB Depaneling Machine Application

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;

Our Service:
# 1 day delivery
# 24 hours fast response
# Largest manufactory in South China
# 100% responsible for quality
# 18 years experience
# 1 year warranty

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