PCB Laser Cutting Equipment for Flexible PCB Boards with 0.02mm Precision PCB Laser Cutting Equipment Parameter
Parameter | |
Technical parameters | Main body of laser | 1000mm*940mm *1520 mm |
Weight of machine | 450Kg |
Power | AC220 V |
Laser | 355 nm |
Laser | Optowave 10W(US) |
Material | ≤1.2 mm |
Precisio | ±20 μm |
Platfor | ±2 μm |
Platform | ±2 μm |
Working area | 300*300mm |
Maximum | 3 KW |
Vibrating | CTI(US) |
Power | AC220 V |
Diameter | 20±5 μm |
Ambient | 20±2 ℃ |
Ambient | ＜60 % |
The Machine | Marble |
PCB Laser Cutting Equipment Advantages
The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.
PCB Laser Cutting Equipment Application
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
Our Service:
# 1 day delivery
# 24 hours fast response
# Largest manufactory in South China
# 100% responsible for quality
# 17 years experience
# 1 year warranty
