The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adaptation of the processing parameters and laser paths. There is no need to factor in retooling times during a change of production.

No appreciable mechanical or thermal stresses occur. Even sensitive substrates can thus be precisely processed.

The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.

The new LPKF CleanCut technology creates absolutely clean and distortion-free cutting channels – setting a new benchmark in the depaneling industry.

Specification:

Cutting Precision:	0.03mm
Moving Speed:	300mm/s
Galvanometer Processing Speed	≤50000mm/s
Min machining line width	0.002mm
Positioning accuracy	0.003mm
Repeatability accuracy	0.003mm
Product Weight	1500KG
Galvanometer Working Field Per One Process	40mmх40mm

Product features:

1. The production capacity is significantly improved by alternate operation of double worktables;

2. The worktable is extended, and it is convenient and safe to take and place the products;

3. Compatible with many lasers, convenient for follow-up maintenance;

4. The vision of laser and camera is concentric, which is convenient for debugging and programming;

5. Machine focus on electronic industry PCB FPC board;

6. Brief introduction of machine software, easy to operate;

Application:

PCB, FPC, Medical Equipment, Automation, LED, Mobile Phone, etc;

Contact Us:

We are always delighted to communicate with you and learn more details from you.

Ryan Guan
Email: s6@smtfly.com
Tel: +86 1360008044 (Wechat/Whatsapp)

Address: 3rd Floor Tongjin High-Tech park
Dalingshang Town Dongguang City, China

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